Renovation of the Espellos Building Envelope / Díaz y Díaz Arquitectos

Renovation of the Espellos Building Envelope / Díaz y Díaz Arquitectos - Exterior Photography, Windows, FacadeRenovation of the Espellos Building Envelope / Díaz y Díaz Arquitectos - Exterior Photography, Facade, WindowsRenovation of the Espellos Building Envelope / Díaz y Díaz Arquitectos - Exterior Photography, Windows, FacadeRenovation of the Espellos Building Envelope / Díaz y Díaz Arquitectos - Exterior Photography, Windows, Garden, CourtyardRenovation of the Espellos Building Envelope / Díaz y Díaz Arquitectos - More Images+ 21

Santiago de Compostela, Spain
  • Year Completion year of this architecture project Year:  2023
  • Photographs
    Photographs:Juan Rodriguez
  • Manufacturers Brands with products used in this architecture project
    Manufacturers:  Thermochip, Trinasolar
  • Lead Architects: Díaz y Díaz Arquitectos (Lucas Díaz Sierra, Gustavo Díaz García) y MIBA Architects
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Renovation of the Espellos Building Envelope / Díaz y Díaz Arquitectos - Exterior Photography, Windows, Facade
© Juan Rodriguez

Text description provided by the architects. In collaboration with MIBA Architects, the first phase of the interior renovation and reorganization of the San Caetano administrative complex is carried out, focusing on the rehabilitation and envelope renovation for the energy improvement of the left rear building, the former "Espellos" building.

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Cite: "Renovation of the Espellos Building Envelope / Díaz y Díaz Arquitectos" [Reforma de la envolvente del edificio de Espellos / Díaz y Díaz Arquitectos] 26 Feb 2024. ArchDaily. Accessed . <https://www.archdaily.com/1013717/renovation-of-the-espellos-building-envelope-diaz-y-diaz-arquitectos> ISSN 0719-8884

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