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  3. RE-Form Product Design Competition 2.0 | Re-Skin

RE-Form Product Design Competition 2.0 | Re-Skin

  • 08:53 - 12 October, 2016
RE-Form Product Design Competition 2.0 | Re-Skin
RE-Form Product Design Competition 2.0 | Re-Skin, Submit at bit.ly/reform2
Submit at bit.ly/reform2

Experiences are intrinsically composed by the tangible and intangible architectures that trigger the senses. It is through this delicate exchange of sensory information that we create lasting impressions from space, objects and interactions. What new exchanges can we envision and suggest through meaningful design? We invite design thinkers to envision new modalities for exchange.

Propose an innovative “skin” in which humans could interact with their surrounding environments and everyday activities through the different intertwined senses. The proposed “skin”/ product could be at any scale and serve any function that the designer envisions.

STARTING POINTS

  • Sustainability: Could new environmental technologies inspire new tactile, visual, olfactory and/or hearing sensing interfaces for our everyday objects and spaces.
  • Biophilia: What are new forms and behaviors inspired from living organisms?
  • Synesthesia. How can some senses be provoked through other sensory stimulation?
  • Impressions: What new “handshakes,” introductions, memories, and feelings can be created or suggested through design?

Students, Assoc. AIA members & Emerging Professionals (less than 10-yrs of experience): $28 Professionals (less than 15-yrs of experience): $44

This competition was submitted by an ArchDaily user. If you'd like to submit a competition, call for submissions or other architectural 'opportunity' please use our "Submit a Competition" form. The views expressed in announcements submitted by ArchDaily users do not necessarily reflect the views of ArchDaily.

Cite: "RE-Form Product Design Competition 2.0 | Re-Skin" 12 Oct 2016. ArchDaily. Accessed . <https://www.archdaily.com/797181/re-form-product-design-competition-re-skin-deadline-extended/> ISSN 0719-8884

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