Vapour-permeable Underlay Board – DHF | EGGER
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Vapour-permeable Underlay Board – DHF | EGGER

  • Available in

  • Use

    Roof and wall cladding
  • Applications

    Residential and General Construction
  • Characteristics

    Vapour-permeable, moisture-resistant, water-draining and windproof surface, puncture-resistant, UV-resistant, optimised tongue and groove profile, nail grid, raw density ≥ 600 kg/m³, practical formats

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EGGER DHF is a synthetic resin-bonded medium-density wood fibreboard designed for the external cladding of roofs and timber-frame walls. It can be used to create a water-draining and wind-resistant roof surface while supporting efficient installation processes.

Manufactured using formaldehyde-free bonding technology and softwood raw materials, the board is designed for low-emission construction applications.

The optimised tongue and groove profile and integrated nail grid support straightforward installation and can contribute to efficient project execution across a wide range of construction applications.

Benefits

  • Rain-resistant from roof pitches of 5° and above without additional nail sealing tape*
  • Integrated nail grid for efficient installation
  • Designed to support streamlined construction processes
  • Available in 15 mm and 20 mm thicknesses
  • Formaldehyde-free bonded board construction
  • Vapour-permeable design that supports moisture transfer through the building envelope

*Subject to compliance with applicable installation requirements and project specifications.

Important: This product is not available in every country. The availability can be checked on EGGER's Website or by contacting them.

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